Release the power module which capsulates the integrated inductor with national semiconductor
Thursday, January 13, 2011 6:57:31 AM
Recently, U.S.A. national semiconductor introduce the required stabilizator IC of power supply circuit in a totally new way, most parts such as MOSFET and inductor integrate and capsulate the inner power module " SIMPLESWITCHERPowerModule " in one . The research and development this time has reduced the inconvenience that the externally positioned inductor brings, has set up the built-in inductor, have removed certain puzzlement for the design of the power supply circuit. This research and development of the new product is suitable for applying to the apparatus frequently of the wide TV, medical equipment, communicating device and industry apparatus,etc. mix electric FPGA, microprocessor and some of load that DSP supplies power (pointofload, PoL) Converter,etc..
SIMPLESWITCHERPowerModule compares with the products that other companies contain the inductor while capsulating, 3 to 500 equinox higher of electric conversion efficiency, the encapsulated surface temperature of the runtime is about 10 ℃. It is introduced, have adopted MOSFET lower in on resistance this time, and optimized the switching circuit, thus has raised electric conversion efficiency, heat radiation, set up the large-area the heat-dissipating area of copper through capsulating the basal plane, the encapsulated thermal resistance (θ JA) Have reduced to 20 ℃/ W. Built-in: inductor and attached the shielding cover, and adopt packaging technique of reducible EMI, thus has met the CISPR22B canonial requirement of electromagnetic radiation. His Built-in: inductor department purchases from other companies, has adopted standard technology, the switching frequency of the power module is 1MHz.
In the past, the power module containing the inductor while capsulating needed to capsulate the basal plane and disposing terminals and distributing the heating pad respectively, and the national semiconductor sets up the terminal on the encapsulated side as the lead wire this time, only capsulating the basal plane disposes the scattered heating pad. Through this kind of method, have got rid of the possibility that flux which can't be differentiated in visualization bridges of taking place, have realized that dispels the heat effectively from capsulating the basal plane.
It is 6V to release voltage range of input and maximum output current this time respectively- " LMZ14203 " of 42V and 3A , " LMZ12003 " of 4.5V- 20V and 3A And " LMZ10504 " of 2.95V- 5.5V and 4A 3 sections of products. Physical dimension is 10.16mm * 13.77mm (including the subdivision of end) *It is thick 4.57 mm. has already begun to supply at present, while buying 500 in batches, the unit price of LMZ14203 is 9.50 dollars, LMZ12003 is 7.25 dollars, LMZ10504 is 7.10 dollars.
Except 3 sections of above-mentioned products that have already begun batch productino, company this to supply output current as 1A and style of 2A successively in the the intersection of 6V- and 42V and the intersection of +4.5V- and products of 20V in voltage range of importing to also, supply the output current as the style of 3A and 5A successively in inputting the products that the voltage range is 2.95V- 5.5V. It is the same to capsulate as 3 sections of products supplied in advance. In addition, this company still shows, while putting out output current bigger products in the future, plan to adopt more high capsulation of the scattered thermal characteristic.


