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Melani Warod

Fly and promise the semiconductor and introduce the nchannel MOSFET device and lengthen the battery life-span in portable application,

Wednesday, January 19, 2011 6:10:52 AM

Flying promises the semi-conductive company (FairchildSemiconductor) Because in conformity with the mobile phone, designs and the component engineer, to the demand for adding the space-saving high-efficient device into his designs of portable application apparatuses such as portable medical equipment and media player,etc., introduce the nchannel MOSFET device FDZ192NZ and FDZ372NZ, these two devices use advanced PowerTrenchreg; The technology, have



Flying promises the semi-conductive company (Fairchild Semiconductor) Because in conformity with the mobile phone, designs and the component engineer, to the demand for adding the space-saving high-efficient device into his designs of portable application apparatuses such as portable medical equipment and media player,etc., introduce the nchannel MOSFET device FDZ192NZ and FDZ372NZ, these two devices use advanced PowerTrench® The technology, have lower RDS (ON) ,More high efficiency, and can lengthen the battery life-span.

FDZ192NZ and FDZ372NZ flying and promising the semiconductor are the chip size of wafer-grade with minimum, thinnest industry (wafer-level chip-scale, WL-CSP) Capsulate the device of the nchannel. These devices are by using the advanced chip level measurement encapsulation technology, can be apparent to save the space of breadboard, it is the portable application that brings the essential advantage.

These advanced WL-CSP MOSFET indicates that capsulate the technical great breakthrough, make, get device can synthesize outstanding the intersection of heat and transfer characteristic, ultrathin capsulate, low the intersection of grid and electric charge and low RDS (ON) The characteristic, and guarantee that can reach RDS (ON) under VGS low to 1.5V Rated value. In addition, HBM ESD that these devices offer greater than 2200V protects the grade.

FDZ192NZ adopts 1.5mm x 1.0mm 0.65mm thick to capsulate; FDZ372NZ adopts 1.0mm x 1.0mm to capsulate, has 0.4mm thickness with leading industry. Compare the proximal similar device of industry of 1.6mm x 1.6mm in size, the volume of FDZ192NZ has been reduced by 41%; But FDZ372NZ has been reduced by 61%, has highly reduced by 40%.

FDZ192NZ and FDZ372NZ fly and promise a part in the semiconductor abundant advanced MOSFET product series, these devices can meet the demand for using for charging, supporting switching over, DC-DC and boost applied compact, slim, high-performance MOSFET device of the market.

Price:

FDZ192NZ, orders 1000, each one, $0.90 U.S. dollar
FDZ372NZ, orders 1000, each one, $0.80 U.S. dollar

Stock: Offer samples now


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