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Vincent Neil

12 inches of wafers of core source capsulate the apparatus and come into operation

12 inches of (300mm) developed by the core source micro electronic device Co., Ltd. of Shenyang The advanced person of the wafer capsulates the apparatus, the long electricity advanced person capsulates Co., Ltd. to measure and confirm through the rigorous craft in Jiangyin recently, have already put into production and used formally

12 inches of (300mm) developed by the core source micro electronic device Co., Ltd. of Shenyang The advanced person of the wafer capsulates the apparatus, the long electricity advanced person capsulates Co., Ltd. to measure and confirm through the rigorous craft in Jiangyin recently, have already put into production and used formally. This is the first 12 inches of chip manufacturing facilities of China, domestic IC is equipped in the wafer size and applied great breakthrough of innovative technology. The rubber-coated apparatus of salient point of 12 inches craft of this full automaticity that the source Company of core of Shenyang introduces newly is used mainly in the even glue for producing many kinds of coated materials of line of chip package / develop to He Jing The round one piece is washed.

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