Vincent Neil

It is reported with the increase of semi-conductive market scale, p-c board (PCB) The backbonded chip PCB market in the market increases rapidly too.

According to organization PRISMSARK of the market research, the semi-conductive productive capacity in the world is expected from 137,400 million 207,400 million rising to 2011 years in 2006, will achieve 8.6% growth rate of every annual mean. Among them, conducting wire frame (Lead Frame) The proportions accounted for will be reduced a little gradually every year, and backbonded chip (Flip Chip) Way PCB productive capacity rose to 9.1% of 2011 years from 3.2% of 2006, it is estimated that it is about 3 times to increase.

Goal array packaging of the backbonded chip (BGA) Compared with general BGA, use BUMP form that is not Bonding Wire, thus accord with the semi-conductive trend that I/O quantity increases. In addition, backbonded chip easy to dispel the heat, adopt BUMP come on the intersection of directly connect and chip, thus has reduce project too.

In view of these advantages, the industry expert thinks unanimously markets of backbonded chip such as the backbonded chip BGA,etc. will expand rapidly in the future.