Vincent Neil

Toshiba (Toshiba) 300mm wafer factory Fab 4 entering into partnership with SanDisk holds the inauguration ceremony. This factory lies in Toshiba in YOKKAICHI of Japan (Yokkaichi) Field in.

Toshiba began to build the above-mentioned factory in August of 2006, it is estimated that began to manufacture in December of 2007 on a large scale, and bring the monthly productivity up to 80,000 slices of wafers in the second half of 2008. From April of 2006 to two years in March of 2008, the capital cost of Fab 4 project estimated 300 billion Japanese yen of Damien (nearly equal to 2,600 million dollars) .

Toshiba and SanDisk represent, the monthly productivity of Fab 4 is expected to improve to 210,000 slices. Fab 4 will adopt craft of 56 nanometers at the beginning, and planned to 43 nanometers of transition gradually since March of 2008. It is said the new factory building has adopted the most advanced earthquake to absorb the structure, can cut down the earthquake effort by 2/3 at most. Toshiba provides funds and builds the BLDG of Fab 4, and it and SanDisk's joint venture Flash Alliance is responsible for raising funds in the manufacturing facilities of installation for this factory.